The bumps appear to be coming from the little metal tensioning tabs pressing against the back of the screen through the copper heat transfer tape a little too hard.
https://youtu.be/xEBYVJ2_r_Q?t=103
https://youtu.be/0poyvpB7Fkw?t=193
iPhone 15 has these tabs but only on the reinforced edges of the frame and Samsung doesn’t use them at all for Galaxy S series
Bizarre design choice from Google to have the tabs press directly into the back of the screen…
Disabling HT usually gives another 100-200MHz at the same load line just because the core pulls less power and runs cooler.
Try 5.8/5.6/5.5 with OCTVB break points at 60C and 70C.
Sadly, no other details were shared at this time on these upcoming CopprLink PCIe cables. The name is arguably a bit odd and separately there is already CopperLink Ethernet cables from a company Patton Electronics. CopprLink hasn’t appeared yet on the USPTO trademark search for reavealing its styling or other details.
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I recently got one of these as a curiosity when their Amazon storefront had a coupon. Mildly impressed at how ‘quiet’ they are for the 2400 RPM rating. Still wouldn’t ever run them at 2400 RPM but I’d rather these at 2400 RPM than the NF-A14 iPPC at 2000 RPM if I had to run a 140mm fan that fast.
More watts = more amps = more voltage drop from LLC AND higher voltage requirement from increased temperature.
You need to increase the AC load line configuration to counter the increased voltage drop, but first consider whether an additional 2-3% all-core performance is worth the 20-30% higher power required.
Thread Director doesn’t do any directing, it’s a a set of new registers the OS scheduler is supposed to read for feedback on how well a thread is running on a core. If APO can do it right, it means the scheduler is wrong.
15.6 HARDWARE FEEDBACK INTERFACE AND INTEL® THREAD DIRECTOR
Intel processors that enumerate CPUID.06H.0H:EAX.HW_FEEDBACK[bit 19] as 1 support Hardware Feedback Interface (HFI). Hardware provides guidance to the Operating System (OS) scheduler to perform optimal workload scheduling through a hardware feedback interface structure in memory.
Components literally popping off of the M2 PCB is absurd. A lot of the M2 sticks do flex a little-to-alot when installed under a heatsink but WD should’ve tested for this.
P3, P5, P7 are all on one side of the CPU, so it’s likely the cooler pressure on the CPU IHS isn’t even for some reason.
Some ideas:
Use more paste and make sure the paste imprint is even.
Double check to make sure you didn’t mix the LGA1200/1700 standoffs which are different lengths.
Make sure the excessively large universal Arctic mounting frame isn’t catching on a VRM component.
Make sure the contact frame tension is even across all four screws