• Scafir@discuss.tchncs.deOP
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      1 year ago

      We are working towards having a product properly packaged. This is a prototype that is not mature enough yet to justify the cost/time to package it. Moreover, this custom chip is used to measure ultra low currents (down to femto amps), so any packaging could potentially interfere with the measurement capabilities (-> no epoxy). It is however protected by a large shielding box, but it’s no use during assembly/modifications :/